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Texas Instruments DS38EP100SD/NOPB specialized interface IC, coax cable and female connector interface, displays application, 6-WDFN exposed pad package, 6-WSON (2.2x2.5), surface mount, ROHS3 compliant, active.

Texas Instruments DS38EP100SDX/NOPB line equalizer, 6-WDFN exposed pad, 6-WSON (2.2x2.5), surface mount, Bulk, coax cable and female connector interface, displays application.

Texas Instruments DS15EA101SQ/NOPB — specialized interface IC for display applications, coax cable and female connector interface, 3.135V–3.465V supply, surface-mount 16-WFQFN exposed pad package.

Omron E3Z series, E3Z-FTP12 2M through-beam photoelectric sensor, PNP open-collector output, Red LED, 20 m sensing range, IP69K, M12 4-pin connector, 10 V supply, -25 to 55 °C.

Espressif Systems ESP32-S2-WROOM-I-N4 WiFi module, 802.11b/g/n, 150Mbps, 2.4GHz, 128kB ROM, 320kB SRAM, U.FL connector, 56-VFQFN exposed pad, -40°C to 125°C.

KYOCERA AVX SCM series supercapacitor module, SCMZ1EP167SRBB0, 165 F, 48 V, 5.22 mOhm ESR, cable with connector termination, Bulk package.

Omron EE-SPW411 through-beam photoelectric sensor, 1 m sensing distance, NPN open-collector Light-ON output, 5 VDC supply, infrared 940 nm emitter, 1 ms response, IP60, adjustable sensitivity, connector termination, bulk pack.

Omron EE-SPW311 through-beam photoelectric sensor, 1 m sensing distance, NPN open-collector Dark-ON output, 5 V supply, 940 nm infrared LED, IP60, adjustable sensitivity, 1 ms response, connector termination, -10°C to 55°C.

AMD Xilinx Kria K26 System-on-Module, Zynq® UltraScale+™ MPSoC, quad ARM Cortex-A53 at 1.333 GHz, dual Cortex-R5F at 533 MHz, 16 GB eMMC, 64 MB QSPI, -40°C to 100°C Tj, 2 x 240-pin connectors, 77.00 mm x 60.00 mm form factor.

Espressif Systems ESP32-C3-MINI-1U-H4, Series ESP32-C3, RF & Wireless ICs, 802.11b/g/n + Bluetooth v5.0, 150Mbps, 2.412GHz ~ 2.484GHz, 4MB Flash, 384kB ROM, 408kB SRAM, -40°C~105°C, 20.5dBm TX power, 53-SMD Module

Maxim Integrated MAX16126TCB+T, Load Dump and Reverse-Voltage Protector, 3V to 30V supply, 224µA supply current, -40°C to 125°C, 12-TQFN (3x3 mm) exposed pad, Active, ROHS3.

Microchip Technology LAN83C185-JT Ethernet PHY controller, 10/100 Base-T/TX, parallel interface, 64-LQFP, 3.3V supply, 40mA, 0°C to 70°C.

Espressif Systems ESP32-S2-WROVER-I-N4R2, ESP32 series, 802.11b/g/n Wi-Fi module, 2.4GHz, 150Mbps, 4MB Flash + 2MB PSRAM, 19.5dBm output, -97dBm sensitivity, U.FL antenna, 56-VFQFN exposed pad.

STMicroelectronics STM32H7 series, ARM Cortex-M7, 32-Bit Single-Core MCU, 550MHz, 1MB (1M x 8) FLASH, 564K x 8 RAM, 100-LQFP, -40°C~85°C (TA).

Analog Devices MAX14636CVB+T USB Charger Detection IC, 150µA supply current, 3.5V ~ 5.5V supply voltage, 10-XFQFN package, Surface Mount, Tape & Reel (TR); Cut Tape (CT).

Maxim Integrated MAX3100EEE+T SPI/UART controller, RS232 and RS485 protocol support, 2.7V–5.5V supply, 150µA supply current, -40°C to 85°C, 16-SSOP (3.90mm Width) package.

Analog Devices MAX4951CTP+ eSATA Buffer, ReDriver, 6 Gbps, 240 ps delay, 90 mA, 3-3.6 V, 20-TQFN, Tube.

Analog Devices MAX4952BCTP+, 2-channel SAS/SATA Buffer/ReDriver, 6 Gbps max data rate, 300 ps delay, 3V-3.6V supply, 20-TQFN exposed pad, 0°C to 70°C.

Texas Instruments TUSB217AIRWBR, USB 2.0 high-speed signal conditioner, 2.3V–6.5V supply, 12-X2QFN (1.6x1.6 mm) package, surface mount, active.

Analog Devices MAX5939EESA Hot Swap Controller, -20V to -80V supply, 700 µA supply current, 8-SOIC (0.154", 3.90mm Width) surface mount package, -40°C to 85°C operating temperature.

Analog Devices MAX14972CTG+, dual USB 3.0 equalizer/redriver, active lifecycle, ROHS3 compliant, Bulk package.

Microchip Technology DSC1123 series MEMS XO (Standard), 148.3516 MHz LVDS output, ±25 ppm stability, 2.25V–3.63V supply, -40°C to 85°C, AEC-Q100 qualified, 6-SMD package.

Espressif Systems ESP32-C3-MINI-1-N4, ESP32-C3 series, 53-SMD Module, 802.11b/g/n + Bluetooth v5.0, 150Mbps data rate, 2.412GHz ~ 2.484GHz, 4MB Flash, 384kB ROM, 400kB SRAM, 20.5dBm TX power, -104dBm sensitivity, -40°C~85°C.

Espressif Systems ESP32-C3 series, ESP32-C3-MINI-1U-N4 RF module, 2.4 GHz 802.11b/g/n + Bluetooth v5.0, 150 Mbps data rate, 4MB flash, 53-SMD module, active production.

Espressif Systems ESP32 series, 802.11b/g/n + Bluetooth v4.2 +EDR module, 2.4 GHz, 150 Mbps, 4MB Flash, 536KB SRAM, U.FL antenna, 55-SMD module, -40 to 85°C.

Espressif Systems ESP32 series, WiFi module, 2.4GHz, 150Mbps, 4MB Flash + 2MB PSRAM, 19.5dBm output, -97dBm sensitivity, 40-SMD module, surface mount.

Texas Instruments MSP430F5xx series MSP430F5522IRGCT, 16-bit MSP430 CPUXV2 core, 25MHz, 32KB Flash, 10K x 8 RAM, 47 I/O, USB 2.0, I²C/SPI/UART, 1.8V-3.6V, -40°C to 85°C, 64-VQFN (9x9).

Texas Instruments SN65LVDS20DRFTG4, Buffer/ReDriver, Single Channel, Differential Input, LVDS Output, 4 Gbps Max Data Rate, 30 ns Delay, 35 mA Supply, 2.375 V to 3.6 V, -40°C to 85°C, 8-WFDFN Exposed Pad, 8-WSON (2x2).

Texas Instruments TPD1E01B04DPLT, bidirectional Zener TVS diode, 3.6V reverse standoff, 15V clamping, 0.18pF capacitance, 27W peak pulse power, HDMI application, 2-X2SON package.

Texas Instruments TPD2E009DRTR, Steering (Rail to Rail) TVS Diode Array, 2 Unidirectional Channels, 5.5V Reverse Standoff, 8V Clamp, 45W Peak Pulse, SOT-3 Package, -40°C to 85°C.

Texas Instruments TPD3E001DRSR, Steering (Rail to Rail) ESD protection diode array, 3 unidirectional channels, 90W peak pulse power, 5.5V reverse standoff, 11V breakdown, -40°C to 85°C, 6-WDFN exposed pad, 6-SON (3x3) package.

Texas Instruments TPD4E001DPKR steering (rail-to-rail) TVS diode array, 4 unidirectional channels, 100W peak pulse power, 5.5V reverse standoff, 6-USON (1.6x1.6) package, -40°C to 85°C operating temperature.

Texas Instruments TPD8S300RUKR, USB OTG protection IC, Internal Switch technology, 3.3V working voltage, 8V clamping, 2 circuits, 20-WQFN (3x3) surface-mount package, active lifecycle.

NXP CBTL06DP213EE,118 6-channel 2:1/4:1 multiplexer for DisplayPort and PCIe applications, 11.1 GHz -3dB bandwidth, 14 Ohm typical on-resistance, 3.0 V to 3.6 V single supply, 48-TFBGA package, -40°C to 105°C operating temperature.

Vishay GBPC2506-/51 single-phase bridge rectifier, standard technology, 600 V peak reverse, 25 A average, 4-Square GBPC package, QC terminal mount, Box.

Vishay GBPC3510-/51 single-phase bridge rectifier, 1 kV peak reverse voltage, 35 A average rectified current, GBPC 4-Square case, QC terminal mounting, Box package.

Analog Devices LTC1694IS5#TRPBF, I²C Bus Accelerator, 1 Channel, 400 kHz, 2.7V to 6V Supply, 60 µA, -40°C to 85°C, TSOT-23-5 Surface Mount.

Microchip Technology DSC1103AI1-160.0000T, XO (Standard), LVDS output, 160 MHz, MEMS resonator, -40°C to 85°C, 6-VDFN, 2.25V–3.63V supply, ±50 ppm stability

Microchip Technology DSC1103 series XO (Standard), 120 MHz LVDS output, MEMS base resonator, ±10 ppm stability, 6-SMD package, -40°C to 85°C, active production.

Microchip DSC1103 series, XO (Standard) MEMS oscillator, 62.5 MHz LVDS output, ±10 ppm stability, 2.25V–3.63V supply, -40°C to 105°C, 6-SMD no-lead package, Tape & Reel.

Microchip DSC1103 series, XO (Standard), LVDS output, 125 MHz, MEMS base resonator, 6-SMD no-lead package, 2.25V~3.63V supply, ±50ppm stability, -20°C~70°C operating range.

Microchip Technology DSC1123CI5-040.0000, XO (Standard) LVDS output, 40 MHz, ±10 ppm stability, 2.25V–3.63V supply, AEC-Q100, -40°C to 85°C, 6-SMD No Lead package.

Microchip Technology DSC61XXB series XO (Standard), 19.2 MHz, CMOS output, MEMS base resonator, AEC-Q100, ±20ppm stability, 1.8V-3.3V supply, 4-VFLGA package, Enable/Disable function.

Microchip Technology DSC8122 series MEMS XO (Standard), output LVPECL, 6-SMD No Lead 3.20mm x 2.50mm, supply 2.25V~3.6V, frequency range 10 MHz ~ 460 MHz, AEC-Q100 rated.

Texas Instruments MAX3232ECPWR, RS-232 transceiver, full duplex, 250kbps data rate, 3V to 5.5V supply, 2/2 drivers/receivers, 16-TSSOP package, 0°C to 70°C operating temperature.

Texas Instruments Tiva™ C series, ARM® Cortex®-M4F 32-bit MCU, 80 MHz, 64 KB Flash, 24 KB RAM, 2 KB EEPROM, CAN/I²C/SPI/UART, -40 to 85°C, 64-LQFP.

Texas Instruments DS25BR101TSDE/NOPB, LVDS Buffer/ReDriver, 1 channel, 3.125 Gbps max data rate, 350 ps delay, Input: CML/LVDS/LVPECL, Output: LVDS, 3V–3.6V supply, 35 mA supply current, -40°C to 85°C, 8-WFDFN Exposed Pad (8-WSON 3x3 mm).

Maxim DS24B33+, 4Kbit Serial EEPROM, 1-Wire® interface, 2 µs access time, 2.8V-5.25V supply, TO-92-3 through-hole package, -40°C to 85°C.

Analog Devices DS2431G+T&R 1Kbit 1-Wire EEPROM, 256 x 4 organization, 2 µs access time, 2-SFN (6x6) package, -40°C to +85°C, ROHS3 compliant.

Analog Devices DS2775G+ Multi-Function Controller, 2-Cell Li-Ion/Polymer, 1-Wire Interface, Over-Current/Over-Voltage Protection, 14-TDFN (3x5), Tube, -20°C to 70°C.

Maxim Integrated DS8024-RJX+, Smart Card Interface IC, Analog Interface, 28-TSSOP (0.173", 4.40mm Width) Surface Mount Package, Tube, ROHS3 Compliant, Active.

Maxim MAX1564ETE+, USB interface IC, 2.7V ~ 5.5V supply, 16-WQFN Exposed Pad package, Surface Mount, active production, ROHS3 compliant.

Analog Devices MAX14970ETP+ Buffer, ReDriver, 2-channel, 6 Gbps, eSATA, 240 ps delay, 20-TQFN Exposed Pad, Tray.

Analog Devices MAX3421EETJ+ USB peripheral/host controller, SPI interface, USB 2.0, 3V-3.6V supply, 15mA, 32-TQFN (5x5mm), -40°C to 85°C, Tube.

Analog Devices MAX4984EEVB+T USB 2.0 DPDT analog switch, 950 MHz -3dB bandwidth, 10 Ohm on-resistance, 2.8V-5.5V supply, 10-UTQFN (1.4x1.8) package, Tape & Reel.

Maxim MAX5920BESA+, Hot Swap Controller, -48V applications, 8-SOIC surface mount, -80V to -20V supply, 700 µA supply current, -40°C to 85°C operating temperature.

Analog Devices MAX9208EAI+ deserializer, 600Mbps data rate, LVDS input, LVCMOS/LVTTL output, 28-SSOP (0.209", 5.30mm Width), surface mount, tube.

Renesas 9DBL0951BKILF, PCI Express (PCIe) clock buffer with integrated PLL, 1:9 HCSL fanout, 200 MHz max, 3.135V–3.465V supply, -40°C to 85°C, 48-VFQFPN (6x6).

Maxim Integrated MAX6604AAHA+ temperature monitoring system for DIMM DDR memory, internal sensor, ±3°C accuracy, I²C/SMBus output, 8-TSSOP package, tube.