Single-channel LVDS ReDriver with signal conditioning
The Texas Instruments DS25BR101TSDE/NOPB is a single-channel LVDS buffer and repeater (ReDriver) designed to regenerate and condition high-speed serial signals over lossy backplanes, cables, or long PCB traces. It accepts CML, LVDS, or LVPECL inputs and outputs a clean LVDS signal, with built-in input equalization and output pre-emphasis to compensate for channel attenuation at data rates up to 3.125 Gbps. The 350 ps typical delay keeps added latency minimal for timing-critical links. Housed in an 8-WSON (3x3 mm) package with an exposed thermal pad, it operates from a 3V to 3.6V supply and draws 35 mA typical supply current. The -40°C to 85°C industrial temperature range suits outdoor telecom, base station, and industrial backplane environments.
3.125 Gbps lane speed and signal conditioning
The 3.125 Gbps data rate covers common serial standards like Gigabit Ethernet, SATA, and PCIe Gen1, making this ReDriver a fit for extending reach on FR4 backplanes or cable assemblies where the raw LVDS driver lacks swing margin. Input equalization compensates for high-frequency skin-effect losses, while output pre-emphasis boosts the first few bits after a transition to open the eye at the receiver. The 1.7 pF input capacitance keeps stub loading light on the upstream driver.
Active production, no obsolescence concern
The DS25BR101TSDE/NOPB carries an Active product status with ROHS3 compliance. For a production BOM line, this part does not carry imminent obsolescence risk — it is a current, catalog-listed device from Texas Instruments. The -NOPB suffix indicates lead-free (RoHS) plating, and the part is available in Tape & Reel or Cut Tape options for assembly.
Input flexibility: CML, LVDS, LVPECL
The ReDriver accepts three common differential signaling standards on its input — CML, LVDS, and LVPECL — and outputs a standard LVDS swing. This saves a level-shifter or translator when interfacing, for example, an LVPECL oscillator to an LVDS receiver, or a CML SerDes output to an LVDS backplane. The 3V to 3.6V supply range aligns with typical 3.3V backplane rails.
Package and thermal management
The 8-WSON (3x3 mm) package with exposed pad requires a thermal via pattern under the pad to the ground plane for adequate heat dissipation. The 35 mA supply current is modest.