The MAX232 Package Is Going Obsolete, Not the Part: A 2026 Cross-Reference Map for Legacy RS-232 Boards
A 2026 cross-reference map for legacy RS-232 boards: which MAX232 package codes are Obsolete, which stay Active, and how...
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A 2026 cross-reference map for legacy RS-232 boards: which MAX232 package codes are Obsolete, which stay Active, and how...
With 32GB DDR5 modules hitting $400 — four times the price of an entry-level x86 CPU — hardware buyers face impossible B...
As TI and ST both launch 800 VDC power conversion architectures for AI servers at GTC 2026, this guide tells buyers what...
AI datacenters are pushing power semiconductor prices up 20–85% across Infineon, STMicro, Renesas and Chinese vendors — ...
VIS Fab 3 fire and the 8-inch wafer capacity crunch are extending lead times for analog ICs, PMICs and MCUs into 2027. H...
TI announced another round of price increases in September 2026, building on July 2026 hikes of 5-15% on power component...
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Renesas Electronics confirmed new power semiconductor price adjustments effective 2027. This guide covers the confirmed ...
DDR3 supply is tightening as major manufacturers wind down production. This guide covers last-time-buy windows, Winbond ...
Memory costs for broadband routers and set-top boxes have surged up to 600%, threatening telco hardware BOMs. This repor...
Samsung Electro-Mechanics and LG Innotek are running FC-BGA substrate lines at full capacity as AI chips grow larger and...
SiTime Q2 2026 revenue jumped 127% YoY as AI inference clusters pulled clock and TCXO content out of the open market. He...
Lattice FPGA lead times hit 52 weeks as of September 2026. Hardware engineers and procurement desks must pre-book, dual-...
STMicroelectronics has issued a third price increase in 2026, this time targeting power management and discrete devices ...