
MIC910BM5
Microchip Technology
DRAM, SRAM, Flash, and EEPROM each solve a different part of the storage hierarchy—volatile or non-volatile, high-speed or high-density, byte-erasable or block-erasable. Embedded designers weigh density, interface protocol (SPI, I2C, parallel, QSPI), access time, endurance (erase/write cycles), and supply voltage when qualifying a memory IC. Micron, Winbond, ISSI, Cypress (Infineon), and Macronix supply the parts most commonly found on industrial and IoT BOMs. Filter by density and package, check real-time stock levels, download datasheets, and submit a volume RFQ.

Microchip Technology

Micron Technology

Micron Technology

Texas Instruments

Texas Instruments

Analog Devices

Analog Devices

Analog Devices

Analog Devices

Analog Devices

NXP Semiconductors

Texas Instruments

ROHM Semiconductor

Toshiba Semiconductor

Toshiba Semiconductor
Toshiba Semiconductor
Toshiba Semiconductor
Toshiba Semiconductor

Infineon Technologies

Texas Instruments

Analog Devices

NXP Semiconductors
Texas Instruments
Texas Instruments

Texas Instruments
Texas Instruments
Texas Instruments

Texas Instruments

Texas Instruments

Texas Instruments
Texas Instruments

Texas Instruments