
UMB2NTN
ROHM Semiconductor
DRAM, SRAM, Flash, and EEPROM each solve a different part of the storage hierarchy—volatile or non-volatile, high-speed or high-density, byte-erasable or block-erasable. Embedded designers weigh density, interface protocol (SPI, I2C, parallel, QSPI), access time, endurance (erase/write cycles), and supply voltage when qualifying a memory IC. Micron, Winbond, ISSI, Cypress (Infineon), and Macronix supply the parts most commonly found on industrial and IoT BOMs. Filter by density and package, check real-time stock levels, download datasheets, and submit a volume RFQ.

ROHM Semiconductor

ROHM Semiconductor

ROHM Semiconductor

ROHM Semiconductor

ROHM Semiconductor

Vishay

Texas Instruments

Microchip Technology

Microchip Technology

Renesas Electronics

Renesas Electronics

Texas Instruments

Microchip Technology

Microchip Technology

Analog Devices

ROHM Semiconductor

ROHM Semiconductor

Infineon Technologies

NXP Semiconductors

Texas Instruments

Infineon Technologies

Analog Devices

Analog Devices

ROHM Semiconductor

Infineon Technologies

ROHM Semiconductor

Renesas Electronics
Texas Instruments

Texas Instruments

Texas Instruments

Texas Instruments

Analog Devices