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Winbond Electronics — Memory (DRAM / SRAM / Flash / EEPROM)

Winbond Electronics Memory (DRAM / SRAM / Flash / EEPROM) — 160 part numbers with specifications and datasheets. Filter by key specs and request a quote on ICBOMS.

Supplier Device Package
28-SOIC · 16-SOP · 32-QFN (5x5) · 20-QFN (4x4)
Operating Temperature
-40°C ~ 85°C (TA) · 0°C ~ 70°C (TA) · -40°C~85°C(TA) · -40°C~105°C(TA)
Package / Case
28-SOIC (0.295", 7.50mm Width) · 16-SOIC (0.295", 7.50mm Width) · 32-WFQFN Exposed Pad · 20-WFQFN Exposed Pad
Package
Tube · Tray · Bulk · Tape & Reel (TR)
Voltage - Supply
2.4 V ~ 5.5 V · 2.7 V ~ 3.3 V · 2.5V ~ 5.25V · 2.7V ~ 3.6V
Base Product Number
W25M02 · W25N01 · W25N02 · W25N04
Memory Interface
SPI - Quad I/O · SPI · SPI - Quad I/O, DTR · SPI - Quad I/O, QPI, DTR
Access Time
7 ns · 8 ns · 6 ns