ICBOMS

Winbond Electronics — Memory (DRAM / SRAM / Flash / EEPROM)

Turnkey BOM procurement and spot-buy shortage sourcing for Winbond Electronics Memory (DRAM / SRAM / Flash / EEPROM) — 11 part numbers with specifications and

Supplier Device Package
28-SOIC · 16-SOP · 32-QFN (5x5) · 20-QFN (4x4)
Operating Temperature
-40°C ~ 85°C (TA) · 0°C ~ 70°C (TA) · -40°C~85°C(TA) · -40°C~105°C(TA)
Package / Case
28-SOIC (0.295", 7.50mm Width) · 16-SOIC (0.295", 7.50mm Width) · 32-WFQFN Exposed Pad · 20-WFQFN Exposed Pad
Package
Tube · Tray · Bulk · Tape & Reel (TR)
Voltage - Supply
2.4 V ~ 5.5 V · 2.7 V ~ 3.3 V · 2.5V ~ 5.25V · 2.7V ~ 3.6V
Duration
21.3 ~ 64 Sec · 64 Sec · 4 Min
Input Signal
Microphone · SPI · Analog - Differential
Output Signal
PWM Speaker Output · PWM Speaker Output, SPI · Analog - Single Ended

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