LM258DR
Texas Instruments
DRAM, SRAM, Flash, and EEPROM each solve a different part of the storage hierarchy—volatile or non-volatile, high-speed or high-density, byte-erasable or block-erasable. Embedded designers weigh density, interface protocol (SPI, I2C, parallel, QSPI), access time, endurance (erase/write cycles), and supply voltage when qualifying a memory IC. Micron, Winbond, ISSI, Cypress (Infineon), and Macronix supply the parts most commonly found on industrial and IoT BOMs. Filter by density and package, check real-time stock levels, download datasheets, and submit a volume RFQ.
Texas Instruments

STMicroelectronics

Analog Devices

Microchip Technology

Texas Instruments

Texas Instruments

Texas Instruments

Texas Instruments

NXP Semiconductors

Texas Instruments

Texas Instruments

Analog Devices

Analog Devices

NXP Semiconductors

Microchip Technology

Texas Instruments

Infineon Technologies

Texas Instruments
Texas Instruments

ROHM Semiconductor

Infineon Technologies

Texas Instruments

Texas Instruments
Toshiba Semiconductor
Toshiba Semiconductor
Toshiba Semiconductor

Analog Devices

Texas Instruments

Infineon Technologies

Analog Devices

Texas Instruments
Texas Instruments