Logic density and on-chip memory for glue-logic integration
The 10CL016YM164I7G packs 15,408 logic elements and 516,096 total RAM bits — enough for a modest state machine, a UART bridge, or a small FIFO buffer without external SRAM. The 963 LABs/CLBs give the router enough columns to pack combinatorial logic without excessive LUT cascading. With 87 user I/O in a 164-ball MBGA package, this part fits designs that need a moderate interface width — say, a parallel LCD controller plus a few SPI and GPIO lines — without the cost or footprint of a larger BGA.
Supply rail and temperature grade for industrial deployment
A single 1.2V core supply simplifies the power tree — no multiple core rails to sequence. The -40°C to 100°C junction temperature range qualifies this part for outdoor telecom cabinets, engine-bay controllers, or factory-floor equipment where the ambient sees 85°C and the junction climbs higher under load.
The 164-ball MBGA (8x8 mm body) uses a 0.65 mm ball pitch — a 4-layer PCB with via-in-pad or microvias handles the fan-out cleanly. Surface-mount assembly with standard lead-free reflow profiles; the tray packaging suits both hand-place prototypes and pick-and-place production runs.
RoHS compliant, with no lead in the solder balls or mold compound.
