Logic density and I/O for glue-logic integration
The LCMXO3LF-1300E-5MG121I packs 1280 logic elements (LUT4-based) into 160 LABs/CLBs, with 64 Kbit of embedded block RAM on the same die — enough distributed memory to hold a small look-up table or FIFO without an external SRAM. 100 user I/O are brought out to the 121-ball CSFBGA (6x6 mm) package — the ball pitch is 0.50 mm, so the fan-out layer count on the PCB is driven by the I/O density, not the core voltage plane. The core supply operates from 1.14 V to 1.26 V, which means the device can share a 1.2 V rail with other low-voltage logic without an extra regulator.
The 121-CSFBGA (6x6 mm) footprint matches the standard MachXO3 land pattern — the same PCB layout supports the 1300E, 2100E, and 4300E density grades within the same package, so a BOM swap to a higher-density sibling does not require a board spin.
Active lifecycle and compliance documentation
ROHS3 compliant, with no halogen or antimony restrictions beyond the EU RoHS directive — the part ships in a standard tray, and the base product number LCMXO3 is the ordering prefix for the entire MachXO3 family.