2112 logic elements and 206 I/O — what this means for BOM fit
The LCMXO3LF-2100E-6MG256C: The 2112 logic elements (LUT4-based) place this MachXO3 part in the low-density FPGA range, suited for glue logic, bus bridging, and control-plane sequencing where a small CPLD runs out of gates but a larger FPGA overshoots the budget. With 206 user I/O in a 256-ball CSFBGA (9x9 mm), every ball on the outer two rows is an I/O — the inner balls are core supply and ground. This density demands a four-layer PCB minimum to fan out the signal traces without via congestion under the package. The 75776 total RAM bits (distributed block RAM) give about 9.5 KB of on-chip storage — enough for a small FIFO, coefficient table, or line buffer in a video-timing generator, but not for frame buffering.
Supply rail and temperature range — the operating envelope
Core voltage is 1.14 V to 1.26 V (nominal 1.2 V), a narrow window that requires a regulated rail — a 1.2-V LDO or switching regulator with ±3% setpoint accuracy keeps the core inside spec across load transients. The 0°C to 85°C junction temperature grade covers commercial and most industrial indoor environments, but not extended industrial (-40°C) or automotive under-hood. A system that sees sub-zero startup needs a different temperature grade variant.
Active lifecycle and compliance status
The ROHS3 compliance means no restricted substances above threshold limits; no exemption expiry to track. The MachXO3 series is a current production family. For new designs the series is supported; for existing BOMs the part is sourced to order against the line-item quantity.