MAX 10 FPGA — 4000 LEs in a 324-ball BGA
The Intel 10M04SCU324C8G is a MAX 10 family FPGA packing 4000 logic elements and 193536 bits of embedded block RAM in a 324-ball UBGA footprint. With 246 user I/O brought out to the 15×15 mm package, this part is sized for bus-intensive glue logic, sensor aggregation, or simple control-path processing where a small FPGA replaces a handful of discrete logic or a low-end CPLD. The commercial temperature range (0°C to 85°C) suits indoor equipment, office peripherals, and telecom line cards — not engine bays or outdoor enclosures.
I/O and memory — what the 246 pins buy you
The 246 I/O count is high relative to the 4000 logic elements, suiting bus-intensive glue logic or parallel interfaces. The 193536 bits of block RAM handle small FIFOs or coefficient tables.
Temperature grade and environment
Rated for 0°C to 85°C (TJ) — commercial grade. This covers most indoor, climate-controlled environments: server rooms, telecom central offices, test equipment, and consumer electronics. If your application sees -40°C or 100°C ambient, the industrial-temperature sibling 10M04SAU324I7G (same 246 I/O, same package, -40°C to 100°C) is the correct pick.