Lattice Semiconductor OR3T806S208-DB — FPGA / CPLD & Programmable Logic
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Lattice Semiconductor / FPGA / CPLD & Programmable Logic

Lattice OR3T806S208-DB FPGA, 116K gates, 171 I/O, ORCA3C

MPN OR3T806S208-DB
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Lattice Semiconductor ORCA™3C FPGA, OR3T806S208-DB, 116000 gates, 171 I/O, 63488 bits RAM, 3 V, 0°C to 70°C, Surface Mount, Bulk.

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[SPEC] Essential Parameters Snapshot Full Specifications (10)
Supply Voltage 3.0

Full Technical Specifications

10 Parameters
OR3T806S208-DB specifications
Parameter / AttributeSpecification / Value
SeriesORCA™3C
MountingSurface Mount
Operating temperature high0°C to 70°C(TA)
Package_typeBulk
Number of i (O)171
Total ram bits63488
StatusActive
Number of gates116000
Supply voltage3.0
Number of logic elements (Cells)3872
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Technical Details & Description

Active ORCA3C FPGA with 116K gates and 171 I/O

The Lattice Semiconductor OR3T806S208-DB is an FPGA from the ORCA™3C series, packing 116000 gates and 3872 logic elements into a 208-pin surface-mount package. It delivers 171 user I/O and 63488 bits of on-chip block RAM, making it a fit for glue-logic consolidation or medium-density control-path designs in commercial-temperature environments.

What the parametric specs mean for a board-level decision

The 171 I/O count means this part can handle a 32-bit data bus plus address and control lines with room left for peripheral handshakes — useful when you need to hang a memory controller and a few UARTs off the same die without a CPLD expander. 63488 bits of total block RAM (about 8 KB) is enough for small FIFOs, coefficient tables, or a line buffer in a video scaler; anything larger forces an external SRAM or SDRAM interface through the I/O pins. Runs on a 3 V supply rail — common for 3.3 V logic families, but check that your board's 3.3 V regulator can source the core current without droop; the ORCA3C family's dynamic current scales with toggle rate, so a 1 A-rated LDO is a safe starting point for most designs. If the board sees -20°C or 85°C ambient, this part will drift out of timing.

Package and board-fit: 208-pin surface mount in Bulk

Supplied in Bulk (tubes or trays, not tape-and-reel), so it is suited for prototype runs and low-to-medium volume production where pick-and-place feeders aren't critical. The 208-pin QFP-style package has a standard 0.50 mm pitch — a 4-layer board with via-in-pad is recommended for fan-out, though a well-designed 2-layer board can work if the I/O count stays under 100.

Frequently asked questions

Will OR3T806S208-DB drop into a board originally designed for LCMXO3L-4300C-5BG324C?

No — the LCMXO3L-4300C-5BG324C is a MachXO3 FPGA in a 324-ball BGA package with 279 I/O and a 2.375 V supply, while the OR3T806S208-DB is an ORCA3C FPGA in a 208-pin QFP with 171 I/O at 3 V. The package, pinout, and supply rails are different, so a board spin is required.

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