14579 logic elements — what the gate budget buys you
The XC6SLX16-2CSG324C packs 14579 logic cells distributed across 1139 CLB slices, giving you room for a soft-core processor, a few UART/SPI interfaces, and a modest DSP pipeline without running into the slice count. The 589824 total RAM bits feed block memory and FIFO instantiation — enough for a 64 KB packet buffer or a dual-port video line store. 232 user I/O break out to the 324-ball CSPBGA — the 15x15 mm footprint keeps the board area tight, but the 0.8 mm ball pitch demands a 4-layer PCB with via-in-pad for the inner rows. The core supply must stay within 1.14V–1.26V; a 1.2V rail with ±3% regulation covers it.
Package and board-fit — CSPBGA rework reality
The 324-CSPBGA is a 15x15 mm, 0.8 mm pitch BGA. The package is MSL-rated per the standard JEDEC profile — no special bake unless the moisture-barrier bag is breached. For rework, a bottom-side preheat to 150°C and a top-side hot-air nozzle matching the 15x15 outline is the minimum; the centre balls under the die shadow need a longer soak time than the perimeter rows. The supplier device package is the same 324-CSPBGA as the package/case field; no second footprint variant exists for this order code.
Lifecycle and compliance — active, no PCN watch needed
The base product number XC6SLX16 covers multiple speed and temperature variants; the -2 speed grade and C (commercial, 0°C–85°C) suffix are the most widely stocked.