SC-70-6 package — rework and footprint notes
The device is supplied in a 6-pin SC-70-6 package (also designated as 6-TSSOP, SC-88, SOT-363). This is a small surface-mount package with a 0.65 mm pitch — reworkable with a hot-air station if the pad layout is clean and the orientation mark (pin 1) is clearly visible on the board silkscreen. The SC-70-6 has low thermal mass, so a moderate hot-air profile (around 260°C peak, 30 seconds above reflow) will lift the part without damaging adjacent components. No exposed thermal pad — the die is small and the junction-to-ambient thermal resistance is dominated by the copper pad area on the PCB.