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STMicroelectronics STM32F100C8T6BTR — Microcontrollers & Processors (MCU / MPU / DSP)

STM32F100C8T6BTR STM32F1 ARM Cortex-M3 MCU, 24 MHz

MPNSTM32F100C8T6BTR
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STMicroelectronics STM32F100C8T6BTR, STM32F1 series, 32-bit ARM Cortex-M3 MCU, 24 MHz core, 64 KB Flash, 8 KB RAM, 48-LQFP, -40°C to 85°C, 2 V to 3.6 V supply.

$4.8600Ref. price · indicative, final on quote
Packaging48-LQFP
RoHSROHS3 Compliant
SeriesSTM32F1
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32F100C8T6BTR specifications
ParameterValue
SeriesSTM32F1
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed24MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size8K x 8
Core size32-Bit Single-Core
PeripheralsDMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
ConnectivityI²C, IrDA, LINbus, SPI, UART/USART
Number of i (O)37
Core processorARM® Cortex®-M3
Case48-LQFP
Data convertersA/D 10x12b; D/A 2x12b
Program memory size64KB (64K x 8)

Product details

The 24 MHz core speed is the headline parametric for this MCU. At this clock, the Cortex-M3 executes most single-cycle instructions, delivering roughly 0.9 DMIPS/MHz. That's enough for UART polling at 115200 baud, 12-bit ADC sampling in the tens of kilohertz, and PWM generation with sub-microsecond resolution. The flash wait state is zero at 24 MHz, so instruction fetches don't stall.

Memory sizing and peripheral set

64 KB Flash and 8 KB SRAM define the application ceiling. The 8 KB SRAM (organized as 8K x 8) handles moderate data buffers — a 1 KB Modbus register map plus a 2 KB ADC history buffer leaves room for the stack and RTOS kernel objects. The Flash is 64 KB (64K x 8), enough for a FreeRTOS-based application with a USB CDC stack and several peripheral drivers. On the analog side, there are ten 12-bit ADC channels and two 12-bit DAC channels — the DACs are a distinguishing feature versus the STM32F103 which lacks them entirely. The peripheral set includes DMA, a temperature sensor, watchdog timers, and POR/PVD/PDR brown-out management.

Package and footprint — 48-LQFP

This is a common footprint shared across the STM32F100 value-line density options, so a board layout designed for the 48-LQFP can often accommodate a pin-compatible migration to a higher-density STM32F100 variant without a PCB respin. The 37 I/Os include most peripheral pins brought out; check the alternate function mapping in the datasheet when assigning pin functions to avoid conflicts between SPI and USART on shared pads.

Frequently asked questions

What is the difference between STM32F100C8T6BTR and STM32F100C8T6?

The 'BTR' suffix on STM32F100C8T6BTR indicates Tape & Reel packaging, while STM32F100C8T6 typically ships in Tray. The silicon, specifications, and pinout are identical — the difference is purely in the shipping medium for automated assembly lines.