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Micron Technology MT41J128M16JT-093:K — Memory (DRAM / SRAM / Flash / EEPROM)

Micron MT41J128M16JT-093:K DDR3 SDRAM, 2Gbit, 1066 MHz

MPNMT41J128M16JT-093:K
Active

Micron Technology DDR3 SDRAM, 2Gbit, 128M x 16 organization, 1066 MHz clock, 20 ns access time, 1.425 V supply, Parallel interface, 96-FBGA, 0°C to 95°C TC, Bulk.

Micron Technology MT41J128M16JT-093:K datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MT41J128M16JT-093:K specifications
ParameterValue
InterfaceParallel
MountingSurface Mount
Operating temperature high0°C to 95°C (TC)
Frame_size2Gbit
Access time20 ns
Memory typeVolatile
Frequency1066000000
Package_typeBulk
Memory formatDRAM
StatusActive
Supply voltage1.425
Memory organization128M x 16

Product details

Active DDR3 SDRAM for production BOMs

The Micron MT41J128M16JT-093:K is a 2 Gbit DDR3 SDRAM organized as 128M x 16, running at a 1066 MHz clock rate with a 20 ns access time. The x16 data bus width is the primary fit criterion — it mates with memory controllers expecting a 16-bit wide chip, common in DIMM modules and embedded systems that need a single-chip data path rather than two x8 parts.

Speed bin and timing closure

The -093:K speed grade specifies a 1066 MHz clock (data rate 2133 MT/s) with a 20 ns access time. This is the faster bin compared to the -125:K sibling which runs at 800 MHz. When selecting this part, the memory controller's timing parameters — particularly tRCD, tRP, and tCL at the target frequency — must be verified against the datasheet's AC timing tables to ensure the controller can close timing at 1066 MHz without violating setup/hold margins. The 20 ns access time reflects the time from the column address strobe to the first data output. For a controller running at 1066 MHz (cycle time ~0.94 ns), this access time spans about 21 clock cycles — well within the DDR3 read latency budget, but the exact CAS latency programmed in the controller's mode register must match the part's speed bin rating.

Package and board integration

The 96-ball FBGA package is the standard DDR3 footprint — 0.8 mm ball pitch, 14 x 22 ball array. The surface-mount package requires a 4-layer or more PCB to fan out the signals, with careful impedance matching for the DDR3 data, address, and control lines (typically 40-60 ohm single-ended, 80-120 ohm differential for the clock pair). The bulk packaging means the parts ship in tubes or trays, not tape-and-reel — confirm with your assembly house whether they can handle bulk trays on the pick-and-place feeder. Decoupling capacitance placement is critical: one 0.1 µF ceramic per VDD/VDDQ ball pair, placed within 1 mm of the ball, plus a 10 µF bulk cap per supply rail on the board. The 1.425 V supply rail has a tolerance of ±0.075 V per the JEDEC DDR3 standard, so the regulator output must stay within 1.35 V to 1.50 V across load transients.

Sourcing posture for this DDR3 line

The bulk packaging may affect lead time compared to tape-and-reel versions — confirm the packaging preference with your procurement team before placing the order.

Frequently asked questions

Is MT41J128M16JT-093:K compatible with DDR3L memory slots?

The MT41J128M16JT-093:K is a standard DDR3 device with a 1.425 V supply, not a DDR3L part (which runs at 1.35 V). While many DDR3L slots can accept DDR3 modules, the higher voltage may exceed the DDR3L specification. Check the motherboard or system memory controller documentation to confirm whether it supports 1.5 V DDR3 operation before using this part in a DDR3L slot.

What is the speed grade of MT41J128M16JT-093:K?

The -093:K suffix indicates a 1066 MHz clock speed (DDR3-2133 data rate) with a 20 ns access time. This is the faster speed bin in the MT41J128M16 family compared to the -125:K variant which runs at 800 MHz.

What is the replacement or equivalent for MT41J128M16JT-093:K?

The closest functional peer is the MT41J128M16JT-125:K TR, which has the same 2 Gbit density and 128M x 16 organization but operates at 800 MHz instead of 1066 MHz. A board-level change or memory controller reconfiguration may be needed if substituting the slower speed bin.