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Micron Technology MT55L256L18P1F-10 — Microcontrollers & Processors (MCU / MPU / DSP)

Micron MT55L256L18P1F-10 ZBT SRAM, 4Mbit, 5 ns, 100 MHz

MPNMT55L256L18P1F-10
End of Life

Micron ZBT® SRAM, MT55L256L18P1F-10, 4Mbit (256K x 18), 5 ns access time, 100 MHz clock, parallel interface, 3.135V–3.465V supply, 0°C to 70°C, 165-FBGA (13x15 mm).

$5.51Ref. price · indicative, final on quote
Packaging165-TBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MT55L256L18P1F-10 Technical Specifications
ParameterValue
SeriesZBT®
Memory typeVolatile
Mounting typeSurface Mount
Voltage3.135V ~ 3.465V
Frequency100 MHz
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologySRAM - ZBT
Access time5 ns
Memory size4Mbit
Memory formatSRAM
Case165-TBGA
Memory organization256K x 18

Product details

The Micron MT55L256L18P1F-10 is a 4 Mbit ZBT (Zero Bus Turnaround) synchronous SRAM organized as 256K x 18 bits. It is designed for high-throughput applications where back-to-back read and write cycles must occur without dead cycles — think packet buffers in network switches, cache in telecom line cards, or look-up tables in FPGA-based accelerators. The 5 ns access time and 100 MHz clock rate let it keep pace with a 100 MHz bus without wait states, so timing closure on a high-speed memory interface is straightforward.

Package and mounting — 165-ball FBGA

The 165-ball TBGA (13x15 mm body) is a fine-pitch BGA that requires a multi-layer PCB with via-in-pad or microvia routing. It is surface-mount only — no socket option. The commercial temperature range (0°C to 70°C) limits this part to indoor, climate-controlled environments like central-office telecom, data-center networking gear, or benchtop test equipment. Not rated for industrial or automotive use.

Lifecycle and sourcing

The MT55L256L18P1F-10 is listed as Active in production — no end-of-life notice, no last-time-buy pressure. It is RoHS non-compliant (per the listing), so verify your assembly house's exemption policy if you need lead-free solder. This part is sourced and quoted to order through independent distribution; availability and current pricing are confirmed at quote time. For volume BOM commitments, an RFQ is the right next step.

Frequently asked questions

Is MT55L256L18P1F-10 obsolete or end-of-life?

No, the MT55L256L18P1F-10 is listed as Active in production. There is no end-of-life notice or last-time-buy window currently in effect.

What is the access time of MT55L256L18P1F-10?

The access time is 5 ns, which allows single-cycle read/write at the rated 100 MHz clock.

Is MT55L256L18P1F-10 RoHS compliant?

No, the MT55L256L18P1F-10 is listed as RoHS non-compliant. Check your assembly house's exemption policy if lead-free solder is required.

What is the exact package and pinout of MT55L256L18P1F-10?

The package is a 165-ball TBGA (13x15 mm body), surface-mount only. The pinout is defined by the Micron ZBT SRAM family standard; consult the device datasheet for the ball-map diagram.

Does MT55L256L18P1F-10 require any special programming or configuration?

No special programming is required. It is a standard synchronous SRAM with a parallel interface; configuration is handled entirely by the memory controller at power-up.