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Microchip Technology MCP47CVB01-E/MF — Discrete Semiconductors

MCP47CVB01-E/MF 8-Bit DAC, Voltage-Buffered, I²C, 10-DFN

MPNMCP47CVB01-E/MF
End of Life

Microchip Technology MCP47CVB01-E/MF, 8-bit DAC, voltage-buffered output, I²C interface, 16µs settling time, ±0.1 LSB INL/DNL, 10-VFDFN exposed pad package.

$0.98Ref. price · indicative, final on quote
Packaging10-VFDFN Exposed Pad
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MCP47CVB01-E/MF specifications
ParameterValue
Output typeVoltage - Buffered
MountingSurface Mount
Reference typeExternal, Internal
Voltage - supply, analog1.8V ~ 5.5V
Voltage - supply, digital1.8V ~ 5.5V
Data interfaceI²C
Operating temperature-40°C ~ 125°C
PackageTube
ArchitectureCurrent Source
INL (DNL)±0.1, ±0.1
Settling time16µs (Typ)
Number of bits8
Case10-VFDFN Exposed Pad
Differential outputNo
Number of d (A converters)1

Product details

8-bit DAC with current-source architecture for precision voltage output

The MCP47CVB01-E/MF is an 8-bit digital-to-analog converter from Microchip Technology that delivers a voltage-buffered output using a current-source architecture. It communicates over an I²C interface, making it a straightforward fit for mixed-signal boards where a microcontroller already runs that bus. With a settling time of 16 µs (typical), this DAC updates its output fast enough for most closed-loop control loops — think trimming a power supply setpoint or adjusting a sensor bias voltage on the fly. The ±0.1 LSB INL and ±0.1 LSB DNL mean the output lands within a fraction of a least-significant bit of the ideal value, so you are not chasing calibration offsets across temperature.

Supply rails, temperature grade, and package fit

It comes in a 10-VFDFN exposed-pad package (3x3 mm DFN-10). The exposed pad on the underside needs a thermal via pattern to the ground plane to pull heat out of the die; without that the junction temperature climbs faster than the ambient spec suggests. The surface-mount footprint is standard for this package class — no exotic pad geometry required.

Active lifecycle — sourcing posture

The part ships in Tube packaging, which is typical for low-volume prototyping and small-batch production runs. For higher volumes, check whether Microchip offers a tape-and-reel variant of the same die — the tube quantity is usually 91 pieces per tube for this DFN package.