Renesas Electronics 74FCT163244APAG — Discrete Semiconductors
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RoHS Compliant · Lead-Free EIA-481 Standard
Renesas Electronics / Discrete Semiconductors

74FCT163244APAG Buffer, Non-Inverting, 3-State, 48-TSSOP

MPN 74FCT163244APAG
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

74FCT163244APAG, 74FCT series, Buffer Non-Inverting, 3-State output, 48-TFSOP (6.10mm width), 4 elements, 4 bits per element, 2.7V to 3.6V supply, -40°C to 85°C.

In Stock: 4,834 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$2.60 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$2.60
10+ pcs
$2.34
30+ pcs
$2.13
100+ pcs
$1.92
500+ pcs
$1.79
1,000+ pcs
$1.69
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$2.60 / ea

4,834 in stock — maximum per order · 3–4 days lead time

$2.34 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (11)
Package / Case 48-TFSOP (0.240", 6.10mm Width)
Supply Voltage 2.7V ~ 3.6V
Output / Current 8mA, 24mA

Full Technical Specifications

11 Parameters
74FCT163244APAG specifications
Parameter / AttributeSpecification / Value
Series74FCT
Logic typeBuffer, Non-Inverting
Output type3-State
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Current - output high, low8mA, 24mA
Operating temperature-40°C ~ 85°C (TA)
PackageTube
Case48-TFSOP (0.240\", 6.10mm Width)
Number of elements4
Number of bits per element4
Series Sibling Variants

Renesas Electronics 74FCT Series Models

Sibling variants, package options, and speed/density grades in this Renesas Electronics semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

4-bit bus buffer with 3-state control

The 74FCT163244APAG is a 4-element, 4-bit buffer from the 74FCT series, meaning it packs sixteen bits of non-inverting buffering into a single 48-TSSOP package. Each element drives 8 mA high and 24 mA low, which is enough to fan out to multiple CMOS loads on a backplane or to drive the inputs of a downstream FPGA bank without an external line driver. The 3-state output control lets you isolate the bus when the device is deselected — critical in shared data-path designs where multiple peripherals talk over the same traces. The 48-TFSOP package with 0.240-inch body width is a fine-pitch surface-mount footprint — the 0.50 mm lead pitch demands careful PCB routing and a solder-paste stencil matched to the land pattern.

ROHS3 compliant covers the full RoHS exemption set, including lead in solder joints, which simplifies EU and UKCA market entry without an exemption review.

74FCT163244APAG
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