Renesas Electronics 74FCT162244ETPAG — Analog & Data Acquisition
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Renesas Electronics / Analog & Data Acquisition

Renesas 74FCT162244ETPAG Buffer, 24mA, 48-TSSOP

MPN 74FCT162244ETPAG
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Renesas Electronics 74FCT series buffer, non-inverting, 3-state, 74FCT162244ETPAG, 4.5V~5.5V supply, 24mA output, 48-TFSOP (0.240", 6.10mm Width), surface mount, -40°C~85°C.

In Stock: 4,194 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$2.01 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$2.01
10+ pcs
$1.81
30+ pcs
$1.65
100+ pcs
$1.49
500+ pcs
$1.39
1,000+ pcs
$1.31
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[SPEC] Essential Parameters Snapshot Full Specifications (11)
Package / Case 48-TFSOP (0.240", 6.10mm Width)
Supply Voltage 4.5V ~ 5.5V
Output / Current 24mA, 24mA

Full Technical Specifications

11 Parameters
74FCT162244ETPAG specifications
Parameter / AttributeSpecification / Value
Series74FCT
Logic typeBuffer, Non-Inverting
Output type3-State
MountingSurface Mount
Supply voltage4.5V ~ 5.5V
Current - output high, low24mA, 24mA
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
Case48-TFSOP (0.240\", 6.10mm Width)
Number of elements4
Number of bits per element4
Series Sibling Variants

Renesas Electronics 74FCT Series Models

Sibling variants, package options, and speed/density grades in this Renesas Electronics semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

16-bit bus buffer in a 48-TSSOP — the 24 mA drive and 5 V rail

The 74FCT162244ETPAG is a Renesas 16-bit non-inverting buffer with 3-state outputs, built for 5 V bus architectures where you need to drive a heavy load without re-driving the bus. It delivers 24 mA source and 24 mA sink per output, enough to fan out to multiple TTL or CMOS inputs on a backplane without external line drivers. Four elements of four bits each — the 4-bit banks let you gate individual byte lanes independently, useful for memory-mapped I/O or peripheral buses where each byte-wide slice needs its own output enable.

48-TSSOP package — rework and board-fit

The 48-TFSOP (0.240", 6.10 mm width) package is a fine-pitch TSSOP — the 0.5 mm lead pitch means the pad layout needs a clean solder mask defined pad, and the low profile (1.2 mm seated height) fits under mezzanine cards or in tight enclosures. The supplier device package is 48-TSSOP, so the footprint matches standard TSSOP-48 land patterns. Hot-air removal is straightforward with a preheat at 150 °C and a 340 °C nozzle; the part lifts clean if you wet the leads first. Pin 1 is at the chamfered corner, clearly marked on the top-side silkscreen.

74FCT162244ETPAG
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