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Renesas Electronics 71V016SA20BFG8 — Interface & Transceivers

71V016SA20BFG8 SRAM, 1Mbit, 20 ns, 48-CABGA

MPN71V016SA20BFG8
End of Life

Renesas Electronics 71V016SA20BFG8 asynchronous SRAM, 1Mbit (64K x 16), 20 ns access time, parallel interface, 3.0-3.6V, 48-CABGA (7x7), 0°C to 70°C.

$2.72Ref. price · indicative, final on quote
Packaging48-LFBGA
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

71V016SA20BFG8 specifications
ParameterValue
Memory typeVolatile
MountingSurface Mount
Voltage3V ~ 3.6V
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologySRAM - Asynchronous
Access time20 ns
Memory size1Mbit
Memory formatSRAM
Case48-LFBGA
Memory organization64K x 16
Write cycle time - word, page20ns

Product details

Memory fit for a 64K x 16 data bus

The 71V016SA20BFG8 is a 1 Mbit asynchronous SRAM organized as 64K words by 16 bits, accessed in parallel with a 20 ns read/write cycle. The 20 ns access time means the memory can deliver or capture data on a 50 MHz bus without wait states, assuming the controller's output hold time and board trace delay are within budget.

Package and board integration

Supplied in a 48-ball LFBGA (CABGA) package measuring 7 mm x 7 mm, the 71V016SA20BFG8 mounts on the board surface. The fine-pitch BGA requires a controlled solder-paste stencil and reflow profile typical for 0.5 mm to 0.65 mm ball pitch — a 4-layer PCB with microvias under the balls is common for fan-out. The commercial temperature range (0°C to 70°C) limits the part to indoor, non-condensing environments; an industrial-temperature variant would be needed for outdoor or engine-bay deployment.

Frequently asked questions

What is the memory organization and access time of the 71V016SA20BFG8?

The 71V016SA20BFG8 is a 1 Mbit asynchronous SRAM organized as 64K words by 16 bits.

What package does the 71V016SA20BFG8 come in?

The 71V016SA20BFG8 is supplied in a 48-ball LFBGA package, also designated as 48-CABGA (7x7 mm). It is a surface-mount package intended for reflow soldering.