Intel Cyclone® IV E series FPGA, EP4CE6F17I7, 6272 logic elements, 179 user I/O, 276480 total RAM bits, 1.15V–1.25V core supply, -40°C to 100°C (TJ) operating temperature, 256-FBGA (17x17 mm) package.
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C~100°C(TJ) |
| Package | Tray |
| Number of i (O) | 179 |
| Case | 256-LBGA |
| Total RAM bits | 276480 |
| Number of LABs (CLBs) | 392 |
| Number of logic elements (Cells) | 6272 |
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Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.
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6272 logic elements place this part in the entry-to-mid tier of the Cyclone IV E family. The 276480 RAM bits support small FIFOs or line buffers.
Intel is still manufacturing it, no last-time-buy window has opened.
The 256-FBGA (17x17 mm) package with 179 I/O gives a dense pin field. The 179 I/O count includes dedicated clock pins and configuration pins.
The EP4CE6F17I7 has an industrial temperature range (-40°C to 100°C junction), while the EP4CE6F17C8N is rated for commercial temperature (0°C to 85°C junction). Both share the same 6272 logic elements, 179 I/O, and 256-FBGA package. The I7 grade is the correct choice for extended-temperature environments; the C8N saves cost when the operating environment stays above 0°C.
The part is listed with a Tray package and the standard Cyclone IV E RoHS compliance applies — the 'N' suffix variants (e.g., EP4CE6F17C8N) explicitly denote RoHS, but the base EP4CE6F17I7 is manufactured on the same lead-free process. Verify the specific date-code compliance against your internal requirements.
For a higher-density option in the same package, the EP4CE10U14I7N offers 10320 logic elements and 423936 RAM bits but in a different package (256-UBGA). For a commercial-temperature drop-in, the EP4CE6F17C8N shares the same logic density and footprint.