Intel Cyclone® IV E FPGA, EP4CE30F29C8LN, 28848 logic elements, 532 I/O, 608256 total RAM bits, 0.97V~1.03V core supply, 780-FBGA (29x29 mm), commercial temperature 0°C~85°C.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting | Surface Mount |
| Voltage | 0.97V ~ 1.03V |
| Operating temperature | 0°C~85°C(TJ) |
| Package | Tray |
| Number of i (O) | 532 |
| Case | 780-BGA |
| Total RAM bits | 608256 |
| Number of LABs (CLBs) | 1803 |
| Number of logic elements (Cells) | 28848 |
The 608256 total RAM bits provide block RAM for FIFOs or line buffers. The core supply runs at 0.97 V to 1.03 V.
This FPGA is still in the channel but not a safe long-term bet for new designs. If your BOM line calls for the EP4CE30F29C8LN specifically, we can source it through independent distribution and quote to order.
The manufacturer status is Active, but the part carries an eol_hot lifecycle flag — it is orderable now but on the last-time-buy watch. No formal EOL notice has been issued yet.
There is no official drop-in replacement from Intel. A board designed for the 780-BGA footprint can accept a larger Cyclone IV E like the EP4CE75F23C7N, but that requires a different bitstream and has fewer I/O (292 vs 532). For new designs, consider migrating to a Cyclone V or MAX 10 device in the same package.
The Cyclone IV E family supports LVDS, SSTL, HSTL, and other common I/O standards on select banks. The 532 I/O count includes dedicated differential pairs; check the device handbook for per-bank standard support.
The 'LN' suffix indicates a lead-free (RoHS-compliant) finish. The 'N' variant is also lead-free. Both share the same 780-FBGA package and logic density; the difference is in the tin-lead vs lead-free ball alloy, which affects reflow profile and long-term reliability requirements.