Intel MAX® 10 series, 10M50DAF672I6G, FPGA, 50000 logic elements, 500 I/O, 1677312 total RAM bits, 672-BGA package, 1.15V~1.25V supply, -40°C to 100°C operating temperature.
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 500 |
| Case | 672-BGA |
| Total RAM bits | 1677312 |
| Number of LABs (CLBs) | 3125 |
| Number of logic elements (Cells) | 50000 |
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The Intel 10M50DAF672I6G is a MAX® 10 family FPGA with 50000 logic elements and 500 I/O in a 672-BGA package. It carries 1677312 bits of embedded RAM.
The 100°C upper limit means the die temperature, not the ambient — account for self-heating from I/O switching and core activity when sizing the thermal solution.
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Both are MAX 10 FPGAs with 500 I/O, 50000 logic elements, and the same 672-BGA package. The 'C' in the middle of the order code typically indicates a different configuration memory option or speed grade; verify the specific datasheet differences for your application, but they are pin-compatible and functionally interchangeable for most designs.
The 10M50DCF672I6G is the closest functional equivalent — same logic density, I/O count, and footprint. For a lower I/O variant, the 10M50DAF256I6G offers 178 I/O in a 256-BGA package.
The part is listed with a Tray package and surface-mount BGA construction. Intel's MAX 10 series is generally RoHS compliant, but confirm the specific date/lot code on your purchase order to ensure compliance documentation matches your destination market.