Intel MAX® 10 FPGA, 10M50DAF256I6G, 50000 logic elements, 178 I/O, 1677312 total RAM bits, 1.15V–1.25V core supply, -40°C to 100°C junction temperature, 256-FBGA (17x17 mm) package, tray.
| Parameter | Value |
|---|---|
| Series | MAX® 10 |
| Mounting type | Surface Mount |
| Voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 178 |
| Case | 256-LBGA |
| Total RAM bits | 1677312 |
| Number of LABs (CLBs) | 3125 |
| Number of logic elements (Cells) | 50000 |
The Intel 10M50DAF256I6G is a MAX® 10 family FPGA with 50000 logic elements and 178 user I/O in a 256-FBGA package. It carries 1677312 bits of embedded RAM.
The -40°C to 100°C junction temperature range covers industrial and extended-industrial applications.
The junction temperature range is -40°C to 100°C (TJ). This is the die temperature, not ambient — the designer must account for self-heating.
Intel lists no direct replacement for this active part. The 10M40DAF256I6G is a lower-density sibling in the same package and pinout, but it is a functional alternative only if the design fits within 40 000 logic elements.