Intel MAX® 10 FPGA, 10M50DAF256C8G, 50000 logic elements, 178 I/O, 1677312 total RAM bits, 1.15V~1.25V supply, 0°C~85°C operating temperature, 256-LBGA package.
| Parameter | Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Number of i (O) | 178 |
| Case | 256-LBGA |
| Total RAM bits | 1677312 |
| Number of LABs (CLBs) | 3125 |
| Number of logic elements (Cells) | 50000 |
The MAX 10 family is Intel's single-chip, instant-on FPGA line, and the 10M50DAF256C8G is the 50k-LE variant in the 256-ball BGA — a configuration that sees broad use in motor-control, display-bridging, and sensor-fusion designs.
The 256-FBGA (17×17 mm) requires a multi-layer PCB for routing the 178 I/O.
The 10M50DAF256C8G is an Intel MAX 10 FPGA. The official datasheet covers the full MAX 10 family; the device-specific ordering code decodes to 50,000 logic elements, 178 I/O, 256-FBGA package, and commercial temperature range. The datasheet PDF is available from Intel's documentation portal.
The 10M50DAF256C8G is rated for 0°C to 85°C (junction temperature). This is a commercial-temperature grade — not qualified for industrial or automotive extended-range environments.