Intel MAX® 10 FPGA, 10M16DCF256I7G, 16,000 logic elements, 562,176 RAM bits, 178 I/O, 256-FBGA (17x17 mm), 1.15V–1.25V core, -40°C to 100°C TJ, Tray.
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 178 |
| Case | 256-LBGA |
| Total RAM bits | 562176 |
| Number of LABs (CLBs) | 1000 |
| Number of logic elements (Cells) | 16000 |
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Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.
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The 10M16DCF256A7G extends to 125°C TJ.
Active lifecycle status with no end-of-life notice. Intel continues production of this density and package variant.
Yes, the 10M16DCF256I7G and 10M16DCF256I6G share the same die, package, and pinout — the I7 grade is a lower speed grade than the I6. If your design closes timing on the I7, it is a direct BOM swap with no board change. If you need the higher Fmax of the I6, stick with that variant.
Intel Quartus Prime software supports the MAX 10 family, including the 10M16DCF256I7G. Use the device selection within Quartus to target this specific density and package for synthesis, place-and-route, and timing analysis.