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Toshiba SemiconductorSignal Isolation

Toshiba Semiconductor Signal Isolation — 52 part numbers with specifications and datasheets. Filter by key specs and request a quote on ICBOMS.

Package / Case
SOT-553 · 18-DIP (0.300", 7.62mm) · 4-UFBGA, WLCSP
Supplier Device Package
ESV · 18-DIP · 4-WCSP (0.79x0.79)
title
RN2712JE(TE85L,F) · TBD62781APG · TCR2DG12,LF
Mounting Type
Surface Mount · Through Hole
Output Configuration
High Side · Positive
Output Type
P-Channel · Fixed
Package
Tape & Reel (TR); Cut Tape (CT) · Tube

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