The LM3S1J11-IBZ50-C5T: With 67 GPIOs and a connectivity set that includes I²C, SPI, UART, LIN, and IrDA, this part fits into industrial sensor hubs, motor-control interface boards, or multi-axis encoder readers where parallel I/O matters.
Industrial temp grade and package constraints
The 108-BGA package (10x10 mm) with 0.80 mm ball pitch demands a 4-layer PCB with controlled impedance for the high-speed serial lines — a 2-layer board will not fan out the inner rows.
Texas Instruments has marked the LM3S1J11-IBZ50-C5T as obsolete.
