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NXP Semiconductors BFU550R — Microcontrollers & Processors (MCU / MPU / DSP)

NXP BFU550R RF NPN Transistor, 11GHz, 21dB Gain, SOT-143B

MPNBFU550R
End of Life

NXP Semiconductors BFU550R RF NPN transistor, 12V Vce, 50mA Ic, 11GHz fT, 21dB gain, 0.7dB noise figure, AEC-Q101, SOT-143B.

$0.6Ref. price · indicative, final on quote
PackagingTO-253-4, TO-253AA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BFU550R specifications
ParameterValue
MountingSurface Mount
FET typeNPN
Voltage - collector emitter breakdown12V
Current - collector (Ic)50mA
DC current gain (hFE) (Min) @ ic, vce60 @ 15mA, 8V
Power - max450mW
Frequency11GHz
Operating temperature-40°C ~ 150°C (TJ)
Gain21dB
GradeAutomotive
PackageTape & Reel (TR); Cut Tape (CT)
QualificationAEC-Q101
CaseTO-253-4, TO-253AA
Noise figure (dB typ @ f)0.7dB @ 900MHz

Product details

21 dB gain at 900 MHz — the LNA front-end fit

The BFU550R is an NPN RF transistor from NXP, specified for 11 GHz transition frequency and 21 dB gain. The 0.7 dB noise figure at 900 MHz makes it a candidate for the low-noise amplifier (LNA) first stage in a receiver chain — the noise figure of the first active device sets the system noise floor, so a sub-1 dB NF here preserves the signal-to-noise ratio from the antenna.

AEC-Q101 and the 150°C junction ceiling

AEC-Q101 qualification means this transistor passed the automotive stress tests: temperature cycling, high-temperature reverse bias, and ESD robustness per the JEDEC standard for discrete semiconductors. The -40°C to 150°C junction temperature range covers the under-hood ambient — a telematics or V2X module parked in direct sun still has margin before the silicon derates. Maximum collector current is 50 mA, collector-emitter breakdown is 12 V, and power dissipation is 450 mW. The 60 minimum DC current gain at 15 mA, 8 V (hFE) confirms the transistor is in its linear region at the bias point typical for a small-signal RF stage.

SOT-143B footprint and the RF layout

The SOT-143B package (TO-253AA) is a 4-lead surface-mount outline with a collector pad that also acts as the thermal path. The ground lead on pin 2 is the emitter return — the PCB layout should keep this trace as short as possible to the ground plane to minimise emitter inductance, which otherwise degrades gain and noise figure at UHF frequencies.

Active production, sourced per RFQ

NXP lists the BFU550R as Active with RoHS3 compliance.

Frequently asked questions

What is the BFU550R's noise figure at 900 MHz?

The noise figure is 0.7 dB typ at 900 MHz. This sub-1 dB NF makes the transistor suitable for the LNA front-end in a receiver where the first-stage noise figure dominates the system noise floor.

What compliance documentation does NXP provide for BFU550R?

The BFU550R is RoHS3 compliant. AEC-Q101 qualification documentation covers the automotive-grade stress tests.