99-WLCSP — footprint and assembly considerations
The CY8C5488FNI-LP212T comes in a 99-ball WLCSP (5.19 x 5.94 mm). This ultra-compact package saves board area but demands a controlled assembly process: the 0.4 mm ball pitch requires a solder mask defined pad and a stencil aperture sized for consistent solder volume. The 62 I/O are distributed across the array, so fan-out vias need to be placed between balls. The part is ROHS3 compliant, and the MSL rating should be confirmed from the latest Infineon packing label — WLCSP devices are typically MSL 1 or 3.
Infineon lists the CY8C5488FNI-LP212T as Active. For dual-sourcing or a higher-performance option within the same ecosystem, the PSoC 6 CY8C6137BZI-F54 (Cortex-M4, 150 MHz) is a pin-compatible alternative worth evaluating, though it carries a different peripheral set and memory map.