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NXP Semiconductors PCA9420UKZ — Microcontrollers & Processors (MCU / MPU / DSP)

PCA9420UKZ PMIC, 3.3-5.5V, 25-WLCSP, Active

MPNPCA9420UKZ
End of Life

NXP PCA9420UKZ power management IC for low-power MCU, 3.3V~5.5V supply, -40°C~85°C, 25-WLCSP (2.09x2.09), Tape & Reel, ROHS3, Active.

$3.16Ref. price · indicative, final on quote
Packaging25-UFBGA, WLCSP
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

PCA9420UKZ Technical Specifications
ParameterValue
Mounting typeSurface Mount
Voltage3.3V ~ 5.5V
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
ApplicationsMicrocontroller, MCU
Case25-UFBGA, WLCSP

Product details

The PCA9420UKZ: Input supply range is 3.3 V to 5.5 V — this covers single-cell Li-ion (3.6-4.2 V), 3.3 V regulated rails, and 5 V USB VBUS. The part does not require a pre-regulator for any of these common sources, which simplifies the front-end BOM. This suits outdoor IoT nodes, automotive cabin electronics, and industrial sensor modules that see ambient heat but not engine-bay extremes.

WLCSP footprint and board-fit constraints

Housed in a 25-bump WLCSP, 2.09 x 2.09 mm. The 0.4 mm pitch typical of this class demands a controlled solder-paste stencil and a reflow profile matched to the board thickness — the package itself is the floorplan reference for the decoupling capacitor placement. Surface-mount only; the WLCSP has no exposed paddle, so thermal management relies on the PCB copper plane under the die. A four-layer board with a solid ground plane beneath the package is the standard thermal strategy.

Tape & Reel logistics for the procurement desk

Cut Tape works for prototype or low-quantity BOM fills.

Frequently asked questions

What package does PCA9420UKZ use?

It comes in a 25-bump WLCSP (Wafer-Level Chip Scale Package), 2.09 x 2.09 mm. The fine-pitch BGA-style footprint requires a controlled reflow process and a PCB design that accounts for the 0.4 mm ball pitch.