STMicroelectronics M24512-DFCS6TP/K — Memory (DRAM / SRAM / Flash / EEPROM)
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STMicroelectronics / Memory (DRAM / SRAM / Flash / EEPROM)

STMicro M24512-DFCS6TP/K 512Kbit I2C EEPROM, 1 MHz

MPN M24512-DFCS6TP/K
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

STMicroelectronics M24512-DFCS6TP/K EEPROM, 512Kbit, I2C, 1 MHz, 1.7-5.5V, 8-WLCSP, Tape & Reel.

In Stock: 7,391 pcs
MOQ: 1 pcs
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$1.10 / ea

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[SPEC] Essential Parameters Snapshot Full Specifications (14)
Package / Case 8-WFBGA, WLCSP
Supply Voltage 1.7V ~ 5.5V
Speed / Frequency 1 MHz
Memory / RAM 512Kbit

Full Technical Specifications

14 Parameters
M24512-DFCS6TP/K specifications
Parameter / AttributeSpecification / Value
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage1.7V ~ 5.5V
Clock frequency1 MHz
Memory interfaceI2C
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyEEPROM
Access time500 ns
Memory size512Kbit
Memory formatEEPROM
Case8-WFBGA, WLCSP
Memory organization64K x 8
Write cycle time - word, page5ms
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[02] Industrial Packaging Tape & Reel / Tray / Tube

Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.

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Technical Details & Description

512Kbit I2C EEPROM — BOM-fit note

The M24512-DFCS6TP/K is a 512Kbit serial EEPROM from STMicroelectronics, organized as 64K x 8 bits, communicating over an I2C bus at up to 1 MHz. Access time is 500 ns, and the page write cycle completes in 5 ms typical. For a data logger writing 64-byte pages every few seconds, the write cycle doesn't block the bus long enough to miss a sensor read — the I2C master can poll the acknowledge polling sequence and move on.

Package and temperature — board-level fit

Housed in an 8-WLCSP (Wafer-Level Chip-Scale Package), the part measures roughly 1.5 mm x 1.5 mm — the 8-WLCSP footprint is a 0.50 mm pitch ball array. That tiny footprint saves board real estate but demands a controlled reflow profile and a clean solder paste stencil; the package is moisture-sensitive, so bake it before rework if the shelf life has been exceeded. It lives comfortably in outdoor IoT gateways, automotive cabin modules (not under-hood), and factory-floor sensor nodes that see seasonal temperature swings.

No single-source risk — the I2C EEPROM market has multiple second-source options at the same density, though the WLCSP package is specific to this STM part number.

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