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STMicroelectronics STM32MP151AAC3 — Microcontrollers & Processors (MCU / MPU / DSP)

STM32MP151AAC3 STM32MP1 MPU, Cortex-A7 650MHz + M4

MPNSTM32MP151AAC3
End of Life

STMicroelectronics STM32MP1 series microprocessor, ARM Cortex-A7 650 MHz + Cortex-M4 209 MHz, 361-TFBGA (12x12 mm), USB 2.0 OTG PHY, GbE, DDR3/LPDDR3, -40 to +125°C, tray.

$13.73Ref. price · indicative, final on quote
Packaging361-TFBGA
SeriesSTM32MP1
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STM32MP151AAC3 specifications
ParameterValue
SeriesSTM32MP1
MountingSurface Mount
Voltage - i (O)2.5V, 3.3V
Additional interfacesCAN, Ethernet, I²C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
Display & interface controllersHDMI-CEC, LCD
Operating temperature-40°C ~ 125°C (TA)
Number of cores (Bus width)1 Core, 32-Bit
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)
Speed209MHz, 650MHz
PackageTray
Ethernet10/100Mbps, GbE
Core processorARM® Cortex®-A7
Case361-TFBGA
RAM controllersDDR3, DDR3L, LPDDR2, LPDDR3
Co-Processors (DSP)ARM® Cortex®-M4
Security featuresARM TZ
Graphics accelerationYes

Product details

Dual-core asymmetric processing: Cortex-A7 at 650 MHz, Cortex-M4 at 209 MHz

The STM32MP151AAC3 pairs a 650 MHz ARM Cortex-A7 application core with a 209 MHz ARM Cortex-M4 real-time coprocessor. The A7 runs Linux or an RTOS for the UI and networking stack; the M4 handles deterministic control loops, sensor fusion, or motor commutation without jitter from the OS scheduler. This asymmetric architecture means a single chip replaces what used to require a separate MPU and MCU, saving a PCB spin and the inter-processor communication link.

Memory controller flexibility: DDR3, DDR3L, LPDDR2, LPDDR3

The integrated DRAM controller supports four memory types — DDR3, DDR3L, LPDDR2, and LPDDR3. This lets the designer pick the cheapest or lowest-power option available at the time of BOM procurement without changing the PCB layout. The 361-TFBGA (12x12 mm) package requires a 4-layer or 6-layer board for signal integrity on the DDR bus; the 0.50 mm ball pitch demands careful fan-out on the top layer.

Connectivity: dual Ethernet and USB 2.0 OTG with integrated PHY

The part carries two Ethernet MACs — one 10/100 Mbps and one Gigabit Ethernet — so it can bridge a legacy fieldbus to a modern industrial Ethernet backbone without an external switch chip. Three USB 2.0 OTG ports with integrated PHY mean no external transceiver for the OTG role; two additional USB 2.0 host/device ports round out the peripheral set. The integrated PHY saves roughly $0.50–$1.00 per port in BOM cost and frees board area.

The 125°C upper limit covers engine-bay or solar-inverter deployments where the enclosure sees direct sun and internal heating.

Frequently asked questions

What memory types does the STM32MP151AAC3 support?

The integrated DRAM controller supports DDR3, DDR3L, LPDDR2, and LPDDR3. This gives the designer flexibility to use the most cost-effective or lowest-power memory available at BOM time without a board revision.

What is the maximum operating temperature for STM32MP151AAC3?

The 125°C upper limit qualifies it for industrial and automotive-adjacent environments such as engine-bay or outdoor telecom enclosures.