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Intel 5962-9323501MXA — Memory (DRAM / SRAM / Flash / EEPROM)

5962-9323501MXA STMicroelectronics 2Mbit Parallel Flash, 200 ns, -55°C to 125°C

MPN5962-9323501MXA
End of Life

STMicroelectronics, parallel Flash, 5962-9323501MXA, 2Mbit, 256K x 8 organization, 200 ns access time, 4.5 V supply, -55°C to 125°C, 32-pin CDIP, through-hole, bulk.

$136.99Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

5962-9323501MXA specifications
ParameterValue
InterfaceParallel
MountingThrough Hole
Operating temperature high-55°C to 125°C(TC)
Frame_size2Mbit
Access time200 ns
Memory typeNon-Volatile
Package_typeBulk
Memory formatFLASH
Supply voltage4.5
Memory organization256K x 8
Write cycle time - word, page200ns

Product details

The STMicroelectronics 5962-9323501MXA is a 2 Mbit parallel Flash memory organized as 256K x 8 bits, with a 200 ns access time and a 4.5 V supply. It comes in a 32-pin ceramic DIP (CDIP) for through-hole mounting.

The 200 ns access time sets the read-cycle window for the host controller. The write cycle time per word or page is also 200 ns.

Military temperature range — deployment context

The ceramic package handles the thermal expansion mismatch that plastic packages would crack under repeated extreme cycles.

Drop-in check against 5962-9089902MUA

The 5962-9089902MUA is a 1 Mbit (128K x 8) parallel Flash in a surface-mount package, not a through-hole CDIP. The 5962-9323501MXA has twice the density (2 Mbit vs 1 Mbit) and a different footprint. It will not drop into a board designed for the 5962-9089902MUA without a PCB layout change and firmware update to use the larger address space.

Frequently asked questions

What is the memory density of 5962-9323501MXA?

The 5962-9323501MXA has a 2 Mbit capacity organized as 256K x 8 bits.

Will 5962-9323501MXA drop into a panel specified around 5962-9089902MUA?

No. The 5962-9323501MXA is a 2 Mbit through-hole CDIP; the 5962-9089902MUA is a 1 Mbit surface-mount part. They have different footprints and densities, so a PCB layout change and firmware update are required.