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Winbond Electronics — Discrete Semiconductors

Winbond Electronics Discrete Semiconductors — 15 part numbers with specifications and datasheets. Filter by key specs and request a quote on ICBOMS.

Package / Case
16-SOIC (0.154", 3.90mm Width) · 28-DIP (0.600", 15.24mm) · 28-SOIC (0.295", 7.50mm Width) · 20-WFQFN Exposed Pad
Supplier Device Package
16-SOIC · 28-DIP · 28-SOIC · 20-QFN (4x4)
Voltage - Supply
2.4 V ~ 5.5 V · 2.7 V ~ 3.6 V · 1.7V ~ 1.95V · 1.425V ~ 1.575V
Technology
FLASH - NAND (SLC) · SDRAM - DDR3 · SDRAM - DDR3L · SDRAM - Mobile LPDDR3
Access Time
25 ns · 20 ns · 5.5 ns · 5 ns
Clock Frequency
40 MHz · 1.066 GHz · 933 MHz · 667 MHz
Operating Temperature
0°C ~ 70°C (TA) · -40°C ~ 85°C (TA) · -40°C ~ 85°C · -40°C ~ 95°C (TC)
Memory Organization
128M x 8 · 64M x 16 · 16M x 32 · 32M x 8

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