Vishay BU2010-M3/45 — Microcontrollers & Processors (MCU / MPU / DSP)
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RoHS Compliant · Lead-Free EIA-481 Standard
Vishay / Microcontrollers & Processors (MCU / MPU / DSP)

BU2010-M3/45 Bridge Rectifier, 1 kV 20 A, Through Hole

MPN BU2010-M3/45
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Vishay BU2010-M3/45, Single Phase Bridge Rectifier, Standard Technology, 1 kV Peak Reverse Voltage, 20 A Average Rectified Current, 1.05 V Forward Voltage @ 10 A, Through Hole, 4-SIP BU Package, -55°C to 150°C Junction Temperature, ROHS3 Compliant.

In Stock: 454 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$3.48 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$3.48
10+ pcs
$3.13
30+ pcs
$2.85
100+ pcs
$2.58
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$3.48 / ea

454 in stock — maximum per order · 3–4 days lead time

$3.13 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (10)
Package / Case 4-SIP, BU

Full Technical Specifications

10 Parameters
BU2010-M3/45 specifications
Parameter / AttributeSpecification / Value
Diode typeSingle Phase
MountingThrough Hole
Voltage - peak reverse1 kV
Voltage - forward (Vf) (Max) @ if1.05 V @ 10 A
Current - reverse leakage @ vr5 µA @ 1000 V
Current - average rectified20 A
Operating temperature-55°C ~ 150°C (TJ)
PackageTube
TechnologyStandard
Case4-SIP, BU
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Technical Details & Description

1 kV, 20 A bridge rectifier in the isoCINK+ BU package

The Vishay BU2010-M3/45 is a single-phase bridge rectifier rated for 1 kV peak reverse voltage and 20 A average rectified output current, housed in the through-hole 4-SIP isoCINK+ BU package. Standard recovery technology with a forward voltage drop of 1.05 V at 10 A keeps conduction losses predictable in continuous-duty offline supplies.

Reverse leakage is specified at 5 µA at the full 1000 V blocking voltage, which is tight enough that no snubber is needed across the bridge in most 50/60 Hz line-frequency applications. The 1.05 V forward drop at 10 A is a typical figure — at the full 20 A rated current the drop will be higher, so budget heatsink thermal resistance accordingly. The through-hole 4-SIP isoCINK+ BU package uses a clip-bond construction that spreads heat into the PCB copper planes better than a standard DIP bridge.

Mounting and package note

The 4-SIP isoCINK+ BU package has four through-hole pins on a standard 10.16 mm pitch. The isoCINK+ trademarked construction encapsulates the die in an electrically isolated thermoset that eliminates the need for an insulating pad between the bridge and the heatsink. The tube shipping medium is what the -M3/45 suffix designates — the same die is also available in tape-and-reel for automated assembly.

Frequently asked questions

What is the maximum DC output current for BU2010-M3/45?

The average rectified forward current is rated at 20 A.

What package does BU2010-M3/45 use?

The isoCINK+ construction provides electrical isolation between the die and the heatsink surface, eliminating the need for a separate insulating pad.

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