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ROHM Semiconductor RBQ20T45ANZC9 — Discrete Semiconductors

ROHM RBQ20T45ANZC9 Schottky, 10A, 45V, TO-220FN

MPNRBQ20T45ANZC9
End of Life

ROHM Semiconductor RBQ20T45ANZC9 Schottky diode, 1 Pair Common Cathode, 10 A per diode, 45 V, Fast Recovery ≤ 500 ns, TO-220-3 Full Pack, Through Hole.

$1.6Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

RBQ20T45ANZC9 specifications
ParameterValue
Diode typeSchottky
MountingThrough Hole
Voltage - DC reverse (Vr)45 V
Voltage - forward (Vf) (Max) @ if650 mV @ 10 A
Current - reverse leakage @ vr140 µA @ 45 V
Current - average rectified (Io) (per diode)10A
Operating temperature - junction150°C
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTube; Cut Tape (CT)
CaseTO-220-3 Full Pack
Diode configuration1 Pair Common Cathode

Product details

Schottky pair — 10 A per diode, 45 V blocking, low forward drop

The RBQ20T45ANZC9: This dual-diode part integrates a 1 Pair Common Cathode configuration — two Schottky diodes sharing a cathode terminal, saving board space and reducing parasitic inductance compared to discrete diodes. Each diode is rated for 10 A average rectified current (Io) with a maximum forward voltage of 650 mV at 10 A — the Vf figure sets the conduction loss and heatsink requirement in continuous-duty circuits. The 45 V reverse voltage (Vr) maximum defines the DC blocking ceiling; the 140 µA reverse leakage at that voltage is a design parameter for high-temperature operation where leakage doubles the thermal load. Fast recovery speed (≤ 500 ns, > 200 mA Io) qualifies this diode for switching applications such as output rectification in power supplies and freewheeling diodes in motor drives, where reverse recovery charge impacts efficiency.

TO-220FN through-hole — thermal and mounting integration

Housed in a TO-220-3 Full Pack (TO-220FN) through-hole package, the fully molded body provides electrical isolation between the heatsink tab and the die — no insulating pad is needed when bolting to a grounded chassis or heatsink. The 150°C maximum junction temperature sets the thermal budget: derating the forward current above room temperature follows the standard Schottky derating curve, with the TO-220FN case-to-sink thermal resistance governing the heatsink selection. Available in Tube or Cut Tape (CT) packaging — the tube option suits prototype and low-volume builds; Cut Tape supports small-lot pick-and-place rework without full reel commitment.

Compliance and documentation

ROHS3 Compliant per — the part meets the latest EU Restriction of Hazardous Substances directive, exempting it from lead, mercury, cadmium, and other restricted substances.

Frequently asked questions

What package does the RBQ20T45ANZC9 use and does it need an insulating pad?

The TO-220-3 Full Pack (TO-220FN) is a fully molded through-hole package. The die is electrically isolated from the metal tab, so no insulating pad or washer is required when mounting to a heatsink.