NXP Kinetis K10 MK10DN512VMC10, 32-bit ARM Cortex-M4 MCU, 100 MHz, 512 KB Flash, 128 KB RAM, 90 I/O, 1.71-3.6 V, -40 to 105°C, 121-MAPBGA.
| Parameter | Value |
|---|---|
| Series | Kinetis K10 |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.71V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 100MHz |
| Package | Tray |
| RAM size | 128K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | DMA, I²S, LVD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART |
| Number of i (O) | 90 |
| Core processor | ARM® Cortex®-M4 |
| Case | 121-LFBGA |
| Data converters | A/D 42x16b; D/A 2x12b |
| Program memory size | 512KB (512K x 8) |
The MK10DN512VMC10: Housed in a 121-ball MAPBGA measuring 8x8 mm, this is a fine-pitch BGA that requires a multi-layer PCB with via-in-pad capability for routing the 90 I/O and the EBI/EMI bus.
The Kinetis K10 series is a mature portfolio, and NXP typically provides several years of lead-time visibility through authorized channels.
The MK10DN512VMC10 comes in a 121-MAPBGA (8x8 mm) package, while the MK10DN512VLK10 uses an LQFP-80 package. Both share the same core, memory, and peripheral set, but the BGA variant offers a smaller footprint and more I/O (90 vs 66). The choice depends on board area constraints and assembly capability.
NXP provides SDK examples with FreeRTOS integration for the Kinetis K10 series.