Active lifecycle — a current-production FPGA for industrial control and bridging
The LCMXO3LF-9400E-6BG256I: ROHS3 compliant — exempt-free per the latest EU RoHS directive, with no restricted substances above the threshold limits. The part carries full manufacturer warranty and traceability when sourced through authorized or franchised distribution.
9,400 logic cells, 206 I/O — parametric fit for wide-bus glue logic and control-path integration
9,400 logic elements organized into 1,175 LABs/CLBs place this device in the mid-density tier of the MachXO3 family. This is enough fabric to absorb a 32-bit microcontroller bus bridge, a handful of SPI/I2C controllers, and a parallel-to-serial conversion block without resorting to external CPLDs. 206 user I/O in a 256-ball BGA gives a high I/O-to-ball ratio — 50 dedicated I/O balls plus 206 signal balls. The 14x14 mm 0.8 mm pitch CABGA package demands a 4-layer minimum PCB with controlled impedance on the high-speed I/O banks. The remaining 50 balls are power and ground, providing a solid return-path plane for simultaneous switching outputs. 442,368 bits of block RAM — roughly 54 Kbytes — is sized for small FIFOs, register files, or a dual-port video line buffer at VGA resolution. For larger frame buffers, an external SDRAM or DDR memory controller must be implemented in the fabric.
Industrial temperature grade and single-rail core supply
This qualifies it for outdoor telecom enclosures, engine-bay control modules, and factory-floor automation where ambient temperatures exceed 85°C. The junction temperature limit of 100°C means the thermal design must keep the case temperature below roughly 85°C in still air to maintain margin. Core supply is 1.14V to 1.26V — a nominal 1.2V rail with ±5% tolerance. A single external LDO or switching regulator per rail is sufficient; no multiple core voltages are required.