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Lattice Semiconductor Corporation LCMXO3LF-9400E-5BG256I — FPGA / CPLD & Programmable Logic

LCMXO3LF-9400E-5BG256I Lattice MachXO3 FPGA, 9400 LEs

MPNLCMXO3LF-9400E-5BG256I
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Lattice Semiconductor Corporation MachXO3 FPGA, LCMXO3LF-9400E-5BG256I, 9400 logic cells, 206 I/O, 442368 bits RAM, 256-LFBGA package, -40°C to 100°C, Tray.

$27.0000Ref. price · indicative, final on quote
Packaging256-LFBGA
RoHSROHS3 Compliant
SeriesMachXO3
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LCMXO3LF-9400E-5BG256I specifications
ParameterValue
SeriesMachXO3
MountingSurface Mount
Supply voltage1.14V ~ 1.26V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)206
Case256-LFBGA
Total RAM bits442368
Number of LABs (CLBs)1175
Number of logic elements (Cells)9400

Product details

Right-sized logic fabric for instant-on control

The Lattice LCMXO3LF-9400E-5BG256I is a MachXO3 FPGA with 9400 logic cells and 206 user I/O — enough fabric to absorb a board's worth of discrete glue logic, bus bridging, and power-sequencing state machines without reaching for a larger SRAM-based FPGA that needs an external configuration memory. Instant-on, non-volatile configuration means this part is live at power-up with no boot delay — it replaces CPLDs and small FPGAs in applications where the I/O must be valid before the main processor finishes its reset sequence.

Logic density, I/O, and on-chip memory

1175 LABs/CLBs and 442368 total RAM bits give you room for a 32-bit wide FIFO, a few small look-up tables, and a handful of counter/timer blocks — the embedded RAM is sized for line buffers and register files, not frame buffers. 206 I/O in a 256-CABGA (14x14 mm) package — the ball pitch is 0.80 mm, which routes cleanly on a 4-layer board with standard via-in-pad rules.

Active production and compliance

It is ROHS3 compliant, so it passes the material declaration for EU and UKCA markets without an exemption claim. The base product number is LCMXO3 — the speed grade is -5 (standard), and the 'E' suffix indicates the low-power 1.2 V core option. The 'I' suffix is the industrial temperature range, which is the version most often specified for control and communications equipment.

Sourcing and availability

For a BOM hedge, the MachXO3 family includes pin-compatible variants with different logic densities and I/O counts — the 206-ball BGA footprint is shared across several density grades, so a board layout can accept a larger or smaller device if the supply situation shifts.

Frequently asked questions

What is the difference between LCMXO3LF-9400E-5BG256I and LCMXO3LF-9400E-6BG484I?

The key difference is the package and I/O count. The -5BG256I has 206 I/O in a 256-ball BGA, while the -6BG484I has 384 I/O in a 484-ball BGA. Both share the same 9400 logic cells and 442368 bits of RAM, but the larger package gives you more I/O for wider buses or more peripheral interfaces.

What package does LCMXO3LF-9400E-5BG256I use?

It comes in a 256-ball LFBGA (CABGA) package measuring 14x14 mm with a 0.80 mm ball pitch. The mounting type is surface mount, supplied in a tray.

What temperature range does this part support?

This covers most factory automation, telecom, and outdoor equipment applications.