MachXO3 FPGA — logic density and I/O for glue-logic and bridging
The Lattice LCMXO3LF-6900E-6MG256I is a MachXO3-family FPGA packing 6864 logic cells and 206 user I/O in a 256-ball CSPBGA package — a part sized for board-level glue-logic consolidation, control-plane bridging, and sensor aggregation where a small-footprint programmable device replaces a handful of discrete 74-series or CPLD parts. With 858 LABs/CLBs and 245760 bits of embedded block RAM, the fabric can handle moderate-width datapaths and small FIFOs without chewing up logic cells for distributed memory.
The core supply is a tight 1.14 V to 1.26 V window — a 1.2 V nominal rail with ±5 % regulation. A switcher feeding this rail should hold better than 3 % load regulation to stay inside the window under transient load from the fabric switching at speed. A board in an outdoor enclosure, a motor-drive cabinet, or a telecom hut sees the low end; the 100 °C TJ ceiling leaves margin for self-heating in still air.
Package and board-fit — 256-CSFBGA footprint realities
The supplier device package designation 256-CSFBGA (9x9) confirms the die-side footprint; the 206 I/O count means roughly 80 % of the balls are signal pins, the rest being power and ground.
Lifecycle and compliance — active, RoHS3, no end-of-life concern
It is ROHS3 compliant, meaning the part is free of the ten restricted substances including the four phthalates added under EU 2015/863.
Sourcing — quoted to order through independent distribution
No stock-holding claim; each RFQ is handled as a fresh procurement.