6864 logic elements, 279 I/O — the MachXO3 sweet spot
The Lattice LCMXO3LF-6900C-5BG324C is a MachXO3 FPGA packing 6864 logic elements and 279 user I/O in a 324-ball CABGA package. With 858 LABs/CLBs and 245760 bits of embedded block RAM, it sits in the upper-mid density tier of the MachXO3 family — enough fabric for a modest bridge, glue-logic consolidation, or a control-plane co-processor without spilling into a larger package.
Supply rails and temperature grade — the fit check
The commercial temperature grade (0°C to 85°C junction) covers indoor equipment, networking gear, and most industrial enclosures — but if the ambient inside the panel exceeds 70°C, the industrial-temperature sibling (-I suffix) is the safer call.
Package and board-fit — 324-ball CABGA
The 324-CABGA (15x15 mm, 0.80 mm ball pitch) is a mid-density BGA that routes out on four layers without heroic via-in-pad work. The 279 I/O count means roughly 86% of the balls are signal — the rest are power and ground. Plan for at least two solid ground planes under the package to keep the return current path short, especially if any of the I/O banks switch at DDR rates.
Active lifecycle — no LTB pressure, no successor watch
The -5 speed grade (the '5' in the ordering code) is the standard-speed tier; the -6 grade exists for designs that need the extra timing margin.
Peer variants — speed grade and temperature range
The closest parametric sibling is the LCMXO3LF-6900C-6BG324C, which shares the same 6864 LEs, 279 I/O, 324-CABGA package, and commercial temperature range — the only difference is the -6 speed grade (faster timing). For designs that need the same logic density but in a smaller 256-ball package with 206 I/O, the LCMXO3LF-6900E-6MG256C is the compact alternative, though it runs on a 1.14 V core supply.