4320 logic elements, 63 I/O in a 3.80x3.69 mm WLCSP
The LCMXO3LF-4300E-5UWG81CTR1K is a Lattice MachXO3 FPGA packing 4320 logic elements across 540 LABs/CLBs, with 63 user I/O and 94208 total RAM bits. The 81-WLCSP package (3.80x3.69 mm) keeps the footprint small enough for space-constrained portable or embedded designs where board real estate is the limiting factor.
WLCSP package — layout and integration
The 81-WLCSP (Wafer-Level Chip-Scale Package) with a 3.80x3.69 mm body and 0.50 mm typical ball pitch demands a controlled-impedance PCB stack-up and careful fan-out for the 63 I/O. The supplier device package is 81-WLCSP (3.80x3.69), so the footprint matches standard Lattice MachXO3 WLCSP land patterns.