Active production — 2112 LUTs in a 9x9 mm BGA
The LCMXO3LF-2100E-5MG256C: Core voltage runs 1.14 V to 1.26 V, so a single 1.2 V rail powers the whole device.
Logic density and on-chip memory
264 LABs/CLBs give 2112 LUT-equivalent logic cells — enough for a modest glue-logic consolidation, a small state machine, or a bridge between two bus domains. The 75,776 bits of block RAM handle small FIFOs or look-up tables without external SRAM. 206 I/O in a 256-ball BGA means the die-to-package ratio is I/O-limited, not core-limited — the pinout fans out to the board edge with plenty of spare balls for supply and ground. The 9x9 mm footprint keeps board real estate tight.
Package and rework reality
ROHS3 compliant — no RoHS exemption expiry to track. The solder balls are SAC305 or similar; reflow profile per JEDEC J-STD-020 at 245°C peak.