1280 LUTs in a 2.54 x 2.59 mm WLCSP
The Lattice LCMXO3LF-1300E-5UWG36ITR1K is a MachXO3 FPGA packing 1280 logic elements (LUTs) in a 36-ball WLCSP that measures just 2.54 x 2.59 mm on the board. That die-scale footprint makes it a fit for space-constrained portable or embedded designs where a larger BGA or QFP package would not route. With 28 user I/O and 64 Kbit of embedded block RAM distributed across 160 logic-array blocks, this device handles glue-logic consolidation, I/O expansion, or control-plane sequencing without the power and latency of a larger FPGA. The core supply is a tight 1.14 V to 1.26 V — the 1.2 V nominal rail must stay within that window across load transients, or the internal PLLs and routing can lose lock.
Industrial temperature grade and active lifecycle
That range covers outdoor telecom enclosures, engine-bay-adjacent modules, and factory-floor controllers where the ambient can hit 85°C with self-heating on top. The part is ROHS3 compliant and ships in Tape & Reel — the standard format for high-volume pick-and-place assembly.
Sourcing and BOM-fit considerations
The 36-WLCSP package uses a 0.4 mm ball pitch — a standard HDI PCB stack-up with microvias can fan out all 28 I/O on two layers, but the centre balls (VCC and GND) need a via-in-pad or a buried via to avoid routing congestion. The 2.54 x 2.59 mm body means the decoupling caps sit outside the package shadow, not under it. No minimum order quantity is imposed at the quote stage.