1280 LEs in a 2.54×2.59 mm WLCSP — the tightest MachXO3 footprint
The LCMXO3LF-1300E-5UWG36CTR1K packs 1280 logic elements and 28 I/O into a 36-ball WLCSP that measures 2.54×2.59 mm — the smallest package in the MachXO3 family for this density tier. That 28 I/O count in a 36-ball grid means 8 balls are dedicated to power and ground, so every signal ball on the perimeter carries a function. The core runs on a single 1.14V–1.26V rail, which simplifies the power tree compared to a dual-supply FPGA. With 64 Kbit of embedded block RAM, this part handles small FIFOs, look-up tables, or configuration registers — not frame buffers or large packet queues.
28 I/O — what the ball map tells a layout engineer
With 28 I/O, the outer two rows carry signals; the inner balls are VCC and GND. The layout engineer needs to fan out the perimeter balls on a microvia layer — a 4-layer board with laser-drilled vias is the standard approach. The 0°C to 85°C (TJ) commercial temperature grade means the part is specified for indoor, controlled-environment equipment — not for an outdoor radio head or under-hood module. Surface-mount assembly follows the JEDEC J-STD-020 profile for a 0.4 mm pitch WLCSP.