WLCSP footprint and board-fit
The LCMXO3L-4300E-5UWG81CTR1K: The 81-WLCSP package measures 3.80 x 3.69 mm — the die is the package, so the ball pitch and pad size on the board are the only mechanical constraints. The 63 I/O fan out from the centre array; a four-layer board with microvias is the standard approach for this ball pitch.
Logic density and memory headroom
4320 logic cells arranged in 540 LABs/CLBs, backed by 94 Kbit of embedded RAM. The 1.14 V to 1.26 V core supply means the device runs from a single 1.2 V rail — no separate VCCIO for the core. The 63 user I/O are banked and can be assigned to different I/O standards within the same supply range.
Marked as Active by Lattice, with ROHS3 compliance.
