4320 logic elements, 279 I/O — BOM-fit for glue-logic consolidation
The Lattice LCMXO3L-4300C-5BG324C is a MachXO3 FPGA packing 4320 logic elements (540 LABs/CLBs) and 279 user I/O in a 324-ball CABGA package. With 94 Kbit of distributed block RAM and a 2.375 V to 3.465 V supply range, it targets board-level glue-logic consolidation — replacing multiple discrete PLDs, level translators, and bus-interface buffers with a single instant-on device.
The 'C' suffix in the order code denotes the commercial temperature range: 0°C to 85°C junction. This is the standard grade for networking gear, industrial controllers, and test equipment that lives in a climate-controlled enclosure. If your BOM calls for -40°C operation, the 'E' (extended) or 'L' (industrial) temperature variants in the MachXO3 family are the correct drop-in — same logic density, same package footprint, different suffix. The 279 I/O count is the headline routing resource — enough to interface a 32-bit bus plus control signals, or to fan out a dozen SPI/I2C bridges without a secondary CPLD. Each I/O is configurable for LVCMOS, LVTTL, SSTL, or HSTL standards, and the bank voltage can be set independently per bank within the 2.375-3.465 V rail.
324-ball CABGA — reflow profile and board integration
The 324-CABGA (15x15 mm) is a 1.0 mm pitch BGA — no micro-vias needed for fan-out on a standard 4-layer board. The 15x15 array with 279 signal balls leaves 45 balls for power and ground, which is enough to keep simultaneous switching noise under control at moderate edge rates. Check the MSL (moisture sensitivity level) before the reflow profile is locked in; the MachXO3 family typically ships at MSL 3, meaning a 168-hour floor life after the bake — if the panel sits longer, a pre-bake at 125°C for 48 hours prevents popcorning.