256 LUT fabric in an 8×8 mm BGA
The LCMXO256C-3MN100C packs 256 logic cells and 32 LABs/CLBs into a 100-CSBGA package that measures 8×8 mm. That is a tight LUT-per-area ratio for glue-logic consolidation or a small state machine on a space-constrained board.
Package and board-fit realities
The 100-LFBGA, CSPBGA footprint is a 0.8 mm pitch array — a 4-layer board is the practical minimum for fan-out; two layers will trap signals in the inner balls. The supplier device package is 100-CSBGA (8×8), so the land pattern matches the standard Lattice MachXO BGA outline. Surface-mount assembly with a tray handling format. No exposed thermal pad — the junction-to-board thermal path runs through the BGA balls; keep the inner-layer ground planes under the package for heat spreading.
Lattice Semiconductor lists the LCMXO256C-3MN100C as Active and ROHS3 Compliant. The base product number is LCMXO256, which shares the MachXO series with siblings that differ in temperature grade or density.